Bright Electro Tin/Lead

Selective Tin Dipping

Copper & Nickel

Electro Tin

Hot Dipping Tin

Re-Tinning

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HOT DIP AND ELECTRO TINNERS

Established 1818

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Copper & Nickel

Nickel (Bright & Semi Bright)

The deposits are bright, stress free and ductile with a slight tendency to levelling.

This process can be used in rack and barrel applications for all types of electronic and engineering components. The deposits have excellent receptivity to overplating (further electro-deposits of different metals).

Copper

Using either an acid based process or a widely used cyanide based process giving a fine grain deposit with excellent receptivity to overplating.

Nickel/Tin can be used effectively on brass components to seal the surface and provide a longer surface finish life.

Typical specifications:

100% nickel to BS EN 12540 or
Nickel/Tin or
Nickel/Tin/Lead
Thickness 2 to 10 microns